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  1. International Micro Industries, Inc.

    International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
    Gold4
    TAB2
    Electroplating1
    FlipChip1
    UBM1
    WLP1
    Wafer Bumping1
    Known Good Die1
    Copper electroplating1
    Solder Bumping1
    Thick Photoresist1
    Advanced Chip Packaging0
    Au Bumping0
    Bare Die Packaging0
    Copper Pillar Bumps0
    Fine Pitch Bumps0
    Flip Chip Packaging0
    Gold Bump0
    Gold Bumping0
    Indium Bumping0
    Indium Bumps0
    Known Good Packaging0
    Pillar Bumps0
    Sn Bumping0
    Sn Bumps0
    Solder Bumps0
    Tape Automated Bonding0
    Tin Bumps0
    Tin Lead Bumps0
    Wafer Electroplating0
    Wafer Level Processing0

    www.imi-corp.com - 2009-02-06

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